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We are giving away a free copy of Ken Kuang's RF and Microwave Microelectronics Packaging to one lucky winner each week! Simply tell us why you deserve to receive this book for free.

RF and Microwave Microelectronics Packaging will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields. Check out more details on Amazon.

Author and CEO Ken Kuang is a top expert on RF and Microwave Microelectronics Packaging. The heat sinks that Torrey Hills Technologies makes are widely used in RF, Microwave, and Power Electronics Packages.

"We¡¯ve been using Torrey Hills heat spreader technologies for RF power amplifier applications for 4 years with great success. Torrey Hills technologies provided the deep knowledge and experience required to help educate us on the many nuances related to heat flow, metallurgy, gold-plating, packaging and how it all relates to our unique RF-Microwave power applications. They helped support our efforts through: R&D, to prototyping, to final production quantities. They always delivered on time, were proactively advising us during R&D, and enabled numerous product success stories. Torrey Hills literally wrote the books on the materials science related to RF-Microwave packaging; they are the world¡¯s expert in this field."
N.Chopra, RF-Microwave Design, Northrop Grumman