White Papers

Properties of WCu, MoCu, and Cu/MoCu/Cu High-Performance Heat Sink Materials and Manufacturing Technologies

Abstract:

We will first present the properties of WCu, MoCu, and Cu/MoCu/Cu high-performance heat sink materials in great detail. Then we will introduce manufacturing technologies such as high-temperature liquid-phase sintering, reactive sintering, and infiltration. Then we will explain CMC/CPC composite manufacturing technologies such as hot rolling lamination, explosive forming, and laser cladding. Finally, we will discuss the WCu and MoCu microelectronics packaging material manufacturing technologies research diagram and present detailed descriptions of each step.





Read the full white paper in THT's book!

It's available on Amazon.com in hardcover, paperback, or Kindle versions, or through Springer.com.