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AlSiC Thermal Management Materials

Abstract:

Aluminum silicon carbide (AlSiC) is a metal-matrix composite consisting of an aluminum matrix with silicon carbide particles. It has a relatively high thermal conductivity (166–255 W/mK), and its thermal expansion can be adjusted to match that of other materials, e.g., silicon and gallium arsenide chips and various ceramics. AlSiC composites are suitable replacements for copper-molybdenum (CuMo) and copper-tungsten (CuW) composite materials as heat sinks, where the application requires lower weight. AlSiC has about one-third the weight of copper, one-fourth that of CuMo, and one-sixth that of CuW. AlSiC is also stronger and stiffer than copper. Currently it is used as a heat sink for power electronics (e.g., IGBT s), heat spreaders, housings for electronics, and lids for chips, e.g., microprocessors and ASICs. This is an introduction to AlSiC materials, covering its basic fabrication methods, and reviewing its applications in microelectronics packaging.