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Tel: (858) 558-6666
Email: sales@torreyhillstech.com
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Tell us about your applications and problems. Our team will find the perfect solution.
Tel: (858) 558-6666
Email: sales@torreyhillstech.com
CuW, or WCu is a pseudo-alloy of copper and tungsten. As copper and tungsten are not mutually soluble, the material is composed of distinct particles of one metal dispersed in a matrix of the other one. The microstructure is therefore rather a metal matrix composite instead of a true alloy.
There are two formulation processes for CuW.
1. Powder metallurgy: A blending of tungsten, copper or copper oxide and various sintering aids are formed under high pressure and then sintered at high temperatures where the material becomes fully dense.
2. Infiltration: The process of infiltrating copper into a tungsten skeleton. This process is performed under pressure and high temperature.
Using Cu to increase electrical and thermal conductivities and W to control CTE (coefficient of thermal expansion).
Commonly used copper tungsten alloy contains 10–50 wt.% of copper, the remaining portion being mostly tungsten. The alloy with less wt.% of copper has higher density, higher hardness and higher resistivity.
As base plates, flange, heat sink, optical bench, laser diode submount, chip carrier, heat spreaders.
Copper Molybdenum (CuMo) and Copper Tungsten (CuW) are considered thermal management materials because they have CTE values that are compatible with the electronic materials and substrate materials. Both these materials have been used extensively in the military and aerospace industry in hermetic packaging because of the CTE thermal management reliability required in these systems. CuMo is lighter than CuW and is used for weight sensitive applications as a replacement for CuW
Cu/Mo/Cu laminate. Cu and Mo are laminated at elevated temperatures (or hot rolling). Most CMC’s are used as heat spreaders or flanges.
CuW is a uniform structure. Immediately under the die, there is a uniform CuW. If CMC is used, the die will see pure Cu at microscopic level. Generaly CMC is not used for high reliability applications.
CPC: Copper- Pressed CuMo – Copper
It is a sandwich structure with CuMo (typically Mo70Cu30) sandwiched by 2 layers of Cu. The hot lamination process is very similar to that of CMC. CPC has relatively higher thermal conductivity than that of CMC and CuW. Its CTE is anisotropic (X-Y directions are different). Most CPC are used for long and skinny dice (like LDMOS). CuW is a uniform structure. Immediately under the die, there is a uniform CuW. If CPC is used, the die will see pure Cu at microscopic level. Generally CPC is not used for high reliability applications.
We own the ISO 9001 certified manufacturing plant called Jiangsu Dingqi Science and Technology, Co. Ltd. in Yixing, China. We have supported lot of active customers in 60+ different countries, including Toyota, ABB, Boeing, Cobham, International Rectifier, L3, Infineon, GE Global Research, BAE, Raytheon, HCC, Egide, IBM, Freescale, GM, Nokia, Red Digital, Cree, Dupont, JDSU, Finisar, Huawei and more.
Our standard reference is ASTM B702 for the material.
Yes, the material supplied by Torrey Hills Technologies is conflict mineral free.
Torrey Hills Technologies, LLC
6265 Greenwich Dr, Ste 105, San Diego, CA 92122 | Tel: (858) 558-6666 | Fax: (858) 630-3383 |
Email: sales@torreyhillstech.com
Torrey Hills Technologies, LLC
6265 Greenwich Dr, Ste 105, San Diego, CA 92122 | Tel: (858) 558-6666 | Fax: (858) 630-3383 |
Email: sales@torreyhillstech.com