White Papers

Packaging of Transmit/Receive Modules

Abstract:

Transmit/Receive (T/R) modules were initially developed as the key component in phased array radar systems, which allowed the antenna beam to be scanned electronically. This was an important innovation over mechanically scanned arrays since it improved reliability, decreased beam scan time, and allowed other functionality. T/R modules are now used or are planned for use in satellites, wireless back- haul communication, mobile phones, Wi-Fi, and 5G mobile communication systems. As a result, development of T/R modules is expanding and shows no signs of slowing. A key to successful T/R modules is the use of the correct electronic packaging.

This chapter is divided into two main parts. The first part briefly describes phased arrays, gives an example T/R module block diagram, and discusses the major components of T/R modules such as integrated circuits, antenna elements, circulators/ switches, beam forming network, and cooling sub-system. The first part concludes with examples of how phased arrays can be used with T/R modules in cellular base stations, Wi-Fi indoor location systems, 60 GHz Wi-Fi, and millimeter-wave point- to-point systems.

The second part of the chapter describes three types of packaging for T/R modules. They are a brick module, a tile array module, and a panel array. The particular challenges of each are given along with the typical solutions employed. This chapter ends with a discussion of integrated circuit/wafer level packaging T/R modules and a summary and conclusions.