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Research on High-Reliable Low-Loss HTCC Technology Applied in Millimeter Wave SMT Package

Abstract:

Recently, with the continually increasing frequency of microwave monolithic integrated circuits (MMIC), the requests for the microwave performance of package are becoming harder. A good microwave package requires small insertion loss and large return loss. Different RF ports need high isolation. With the advantages such as steady dielectric constant and small dielectric loss, Al2O3 ceramic has been widely applied in microwave and millimeter wave package research. In addition, HTCC technology can route through several layers and is easier for smaller products. So the HTCC technology based on Al2O3 ceramic is widely used in aviation and aero- space communications which have strict requirements about miniaturization and reliability. This chapter will study the millimeter wave package based on HTCC technology.