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Tel: (858) 558-6666
Email: sales@torreyhillstech.com
Other Product Sites
Tell us about your applications and problems. Our team will find the perfect solution.
Tel: (858) 558-6666
Email: sales@torreyhillstech.com
Abstract:
Direct bonded copper (DBC), also called the gas-metal eutectic bonding method, is an important substrate material commonly used for thermal and electrical management in power modules. Developed almost 40 years ago by General Electric, there is wide use of this structure when there is a need of a substrate with high current carrying and high thermal conductive abilities. The components of DBC are a ceramic (usually Aluminum-Oxide (Al2O3, also called "alumina") and a bonded piece of copper on one or both sides. This copper is strongly bonded to the alumina, giving strong adhesion and combining benefits from both materials. This paper will give a summary of DBC technology and will discuss the role that furnace temperature and atmosphere perform during processing.
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Torrey Hills Technologies, LLC
6265 Greenwich Dr, Ste 105, San Diego, CA 92122 | Tel: (858) 558-6666 | Fax: (858) 630-3383 |
Email: sales@torreyhillstech.com
Torrey Hills Technologies, LLC
6265 Greenwich Dr, Ste 105, San Diego, CA 92122 | Tel: (858) 558-6666 | Fax: (858) 630-3383 |
Email: sales@torreyhillstech.com